NTLJS4114NT1G【PDF 1/6 页】MOSFET N-CH 30V 3.6A 6-WDFN

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Sheet目录490

[1页]2页 3页 4页 5页

NTLJS4114N

Power MOSFET

30 V, 7.8 A, m Cool t Single N ? Channel,

2x2 mm WDFN Package

Features

? WDFN Package Provides Exposed Drain Pad for Excellent Thermal

Conduction

? 2x2 mm Footprint Same as SC ? 88

? Lowest R DS(on) in 2x2 mm Package

? 1.8 V R DS(on) Rating for Operation at Low Voltage Logic Level Gate

Drive

? Low Profile (< 0.8 mm) for Easy Fit in Thin Environments

? This is a Pb ? Free Device

Applications

? DC ? DC Conversion

? Boost Circuits for LED Backlights

? Optimized for Battery and Load Management Applications in

Portable Equipment such as, Cell Phones, PDA’s, Media Players, etc.

? Low Side Load Switch for Noisy Environment

V (BR)DSS

30 V

http://onsemi.com

R DS(on) MAX I D MAX (Note 1)

35 m W @ 4.5 V

45 m W @ 2.5 V 7.8 A

55 m W @ 1.8 V

N ? CHANNEL MOSFET

2 JA M G 5

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

Parameter Symbol

Drain ? to ? Source Voltage V DSS

Gate ? to ? Source Voltage V GS

Value

± 12

Unit

Pin 1

WDFN6

CASE 506AP

STYLE 1

MARKING

DIAGRAM

1 6

3 G 4

Continuous Drain

Current (Note 1)

Power Dissipation

(Note 1)

Steady

State

t ≤ 5s

Steady

State

T A = 25 ° C

T A = 85 ° C

T A = 25 ° C

I D

P D

6.0

4.4

7.8

1.92

JA = Specific Device Code

M = Date Code

G = Pb ? Free Package

(Note: Microdot may be in either location)

PIN CONNECTIONS

t ≤ 5s

3.3

Continuous Drain

Current (Note 2)

Power Dissipation

(Note 2)

Steady

State

T A = 25 ° C

T A = 85 ° C

T A = 25 ° C

I D

P D

3.6

2.6

0.70

Pulsed Drain Current

t p = 10 m s

I DM

Operating Junction and Storage Temperature

Source Current (Body Diode) (Note 2)

T J , T STG

I S

? 55 to

150

3.0

° C

(Top View)

ORDERING INFORMATION

Lead Temperature for Soldering Purposes

(1/8 ″ from case for 10 s)

T L

260

° C

Device

Package

Shipping ?

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq

[2 oz] including traces).

2. Surface Mounted on FR4 Board using the minimum recommended pad size

of 30 mm2, 2 oz Cu.

NTLJS4114NT1G WDFN6 3000/Tape & Reel

(Pb ? Free)

NTLJS4114NTAG WDFN6 3000/Tape & Reel

(Pb ? Free)

?For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

? Semiconductor Components Industries, LLC, 2012

November, 2012 ? Rev. 3

Publication Order Number:

NTLJS4114N/D

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